parametry procesu CMOS

SkrótPełna nazwa
First oxidation
FSTOXTIMEFirst oxidation time
FSTOXTEMPFirst oxidation temperature
FSTOXP02First oxidation oxygen partial pressure
Well implantation
WELLIMPENERWell implant energy
WELLIMPDOSEWell implant dose
Well oxidation
WELLOXTIMEWell oxidation time
WELLOXTEMPWell oxidation temperature
WELLOXPO2Well oxidation oxygen partial pressure
WELLOXPHCLWell oxidation HCl partial pressure
Well drive-in
WELLDITIMEWell drive-in time
WELLDITEMPWell drive-in temperature
Buffer oxidation
BUFOXTIMEBuffer oxidation time
BUFOXTEMPBuffer oxidation temperature
BUFOXPO2Buffer oxidation oxygen partial pressure
BUFOXPHCLBuffer oxidation HCl partial pressure
First densification
DENS1TIMEFirst densification time
DENS1TEMPFirst densification temperature
N field implantation
NFIMPENERN field implant energy
NFIMPDOSEN field implant dose
P field implantation
PFIMPENERP field implant energy
PFIMPDOSEP field implant dose
Field oxidation
FOXTIMEField oxidation time
FOXTEMPField oxidation temperature
FOXPO2Field oxid. oxygen partial pressure
First gate oxidation
GOX1TIMEFirst gate oxidation time
GOX1TEMPFirst gate oxidation temperature
GOX1PO2First gate oxid. oxygen partial pressure
GOX1PHCLFirst gate oxid. HCl partial pressure
Second gate oxidation
GOX2TIMESecond gate oxidation time
GOX2TEMPSecond gate oxidation temperature
GOX2PO2Second gate oxidation oxygen partial pressure
GOX2PHCLSecond gate oxidation HCl partial pressure
Channel implantation
CHIMPDOSEChannel implant dose
CHIMPENERChannel implant energy
Deposition of polysilicon
POLYTIMEPolySi deposition time
POLYTEMPPolySi deposition temperature
Doping of polysilicon
POLYDOPTIMPolySi doping time
POLYDOPTMPPolySi doping temperature
Oxidation of polysilicon
POXTIMEPolySi oxidation time
POXTEMPPolySi oxidation temperature
P source/drain implantation
PSDIMPENERP-source/drain implant energy
PSDIMPDOSEP-source/drain implant dose
N source/drain implantation
NSDIMPENERN-source/drain implant energy
NSDIMPDOSEN-source/drain implant dose
Second densification
DENS2TIMESecond densification time
DENS2TEMPSecond densification temperature
Contact predeposition
CTPRETIMEContact predeposition time
CTPRETEMPContact predeposition temperature
CTPRENSContact predeposition surface concentration
Contact drive-in
CTDITIMEContact drive-in time
CTDITEMPContact drive-in temperature